TEVOS

Program Manager – Chip Design

Micron · Hyderabad, TS, IN · India

Operations Lead Full-time Verified source Salary not disclosed

Posted 3 May 2026 (first seen by Tevos)
Last confirmed 26 Oct 2026 (last seen by Tevos)

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Job description

Key Responsibilities

Program Planning & Execution

  • Own end‑to‑end program plans for chip design programs from concept → tape‑out → silicon bring‑up.
  • Develop and maintain coordinated schedules, achievements, and critical paths across:
  • Architecture
  • RTL & DV
  • Physical Design
  • CAD / Methodology
  • DFT, AMS, Packaging, and Silicon Validation
  • Drive program reviews, achievement readiness, and stage‑gate decisions.

Multi-Functional Leadership

  • Act as the primary interface between Design, Verification, Layout, CAD, Technology, Product Engineering, Manufacturing, and Business teams.
  • Drive alignment across global teams (India, US, Japan, etc.).
  • Resolve cross‑team dependencies, priority conflicts, and execution bottlenecks.

Risk, Issue & Transition Coordination

  • Proactively identify schedule, technical, resource, and dependency risks.
  • Drive mitigation and recovery plans for execution gaps.
  • Own change control for scope, schedule, and resource adjustments.

Execution Metrics & Reporting

  • Define and track program critical metrics:
  • Schedule health
  • Resource loading
  • Design & verification readiness
  • Tape‑out quality indicators
  • Provide clear, concise executive updates with data‑driven insights.
  • Ensure clarity through dashboards and weekly program reports.

Quality & Process Excellence

  • Ensure compliance with product lifecycle management (PLM), design sign‑off criteria, and quality gates.
  • Drive post‑mortems / retrospectives and institutionalize findings.
  • Partner with CAD and methodology teams to improve design productivity and predictability (automation, AI, tooling).

Partner & Leadership Communication

  • Serve as the single point of accountability for program status.
  • Get along with senior leadership, including trade‑offs, risks, and decision asks.
  • Influence without authority and drive execution through teamwork.

Required Qualifications

  • Bachelor’s or Master’s degree in Electrical / Electronics / Computer Engineering (or equivalent).
  • 8–15+ years of experience in semiconductor / chip design programs.
  • Strong understanding of chip design flows, including:
  • Architecture & RTL
  • Design Verification
  • Physical Design / PnR
  • Tape‑out and silicon lifecycle
  • Proven experience managing large, multi-functional, multi-site programs.
  • Strong skills in schedule management, risk management, and executive communication.

Preferred Qualifications

  • Hands‑on background in RTL, DV, PD, or CAD (prior technical role strongly preferred).
  • Experience with memory (DRAM / LPDDR / HBM) or complex SoC programs.
  • Exposure to build and verification flows guided by advanced technology.
  • Experience driving process improvements and automation in design execution.

Key Success Attributes

  • Strong ownership approach and execution rigor.
  • Ability to operate in high ambiguity, fast‑paced environments.
  • Excellent customer management and influencing skills.
  • Data‑driven, structured problem solver with attention to detail.
  • Collaborative leader with a global approach.

Impact of the Role

  • Enable predictable, high‑quality tape‑outs.
  • Improve design cycle time and execution efficiency.
  • Serve as a critical pillar connecting engineering execution with business outcomes.

Source: Micron careers page, collected by Tevos on 26 Oct 2026; verify details on the employer site. Tevos does not take applications — the Apply button opens the employer’s own page.

Apply on Micron site ↗