TEVOS

Firmware Architect

Kandou Ai · Hyderabad, Bangalore · India

Engineering Lead Full-time Verified source Salary not disclosed

Posted 25 Oct 2026 (first seen by Tevos)
Last confirmed 26 Oct 2026 (last seen by Tevos)

Apply on Kandou Ai site ↗

Job description

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO)of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technologypowers a high-performance, chiplet-based AI memory fabricthat is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantlywhile preserving high bandwidth and ultra-low latency— unlocking unprecedented efficiency for AI training and inference at scale.

Kandou’s architecture is not just an incremental improvement — it’s a foundational shiftin how AI hardware is built for the future.

We are actively seeking a Software Architect based in one of the following locations: India (Hyderabad/Bangalore), UK (Reading/Cambridge) Switzerland (Lausanne).

Responsibilities:

  • Architect CMIS 5.x stack (DataPath State Machine, VDM, I2C/MCTP, FW-SW interface)
  • Lead host interop tests for hyperscalers (Meta, AWS, etc.), build test matrix and regression suite
  • Develop manufacturing test orchestration (ATE integration, yield analytics, on-chip stimulus)
  • Build telemetry pipeline from FW to host/cloud (formats, compression, SDK APIs)
  • Own customer SDK and tools (C/Python, CLI, log analysis), release management
  • Ensure standards compliance (CMIS 5.x, OSFP MSA, SFF-8024, OIF)
  • Travel: Up to 25% (customer engagement, manufacturing, standards)

Skills:

  • Good knowledge of C/C++, Python, systems language (Go/Rust); CI/CD, conformance tests
  • Good knowledge of I2C/MCTP, SFF-8024, vendor extensions
  • Good understanding of standards implementation (OIF, SFF, IEEE mgmt-plane)
  • Good knowledge of architecture documentation (SHALL/MUST, REQ traceability)
  • Self-motivated, with strong sense of ownership and responsibility
  • Good communication and reporting skills

Experience:

  • Principal / Senior Staff (8-10 years post-degree)
  • 8-10 years high-speed interconnect software (module SW, management, test, SDK)
  • CMIS 4.x/5.x implementation and OSFP MSA experience
  • Hyperscaler interop with NIC/switch ASICs (Nvidia, Broadcom)
  • Test software architecture with ATE/yields
  • Manufacturing and field support experience

Education:

  • BS in Electrical Engineering, Computer Engineering, or Computer Science (MS preferred)

If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!

https://www.kandou.ai/

Source: Kandou Ai careers page, collected by Tevos on 26 Oct 2026; verify details on the employer site. Tevos does not take applications — the Apply button opens the employer’s own page.

Apply on Kandou Ai site ↗